发明名称 ELECTRONIC PARTS TAKE-OUT MECHANISM
摘要 PURPOSE:To improve the accuracy of taking out parts by providing a conveyer path, a part of which can be displaced independently of the other part thereof. CONSTITUTION:A movable chute 3 is positioned in such a manner that at the time of receiving a DIP (Dual In Package) type ICII transferred from an upper chute 2, the transfer surface thereof is on the same level with the transfer surface of the upper chute 2. After receiving an IC I , the transfer surface is lifted up to the transfer surface of a lower chute 4, so that the DIP-type IC I on the movable chute 3 is slided and delivered onto the transfer surface of the lower chute 4. Accordingly, when the movable chute 3 is on the same level with the upper chute 2, the start end surface of the lower chute 3 functions as a stopper surface for the DIP-type IC I slided along the movable chute 3, and when the movable chute 3 is lifted up, the start end surface of the movable chute 3 functions as a stopper surface for the following DIP-type IC. Thus, parts can be reliably separated and taken out.
申请公布号 JPS59198216(A) 申请公布日期 1984.11.10
申请号 JP19830070647 申请日期 1983.04.21
申请人 IDEYA:KK 发明人 NISHITANI KAZUHIKO
分类号 B65G47/08;B65G47/88 主分类号 B65G47/08
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