| 摘要 |
PURPOSE:The titled composition excellent in moisture resistance and suitable for sealing electronic parts, comprising a curable epoxy resin, an inorganic filler, and a specified coupling agent. CONSTITUTION:To 100pts.wt. curable epoxy resin comprising an epoxy resin having at least two epoxy groups in the molecule and a curing agent (e.g., diaminodiphenylmethane) are added 100-500pts.wt. inorganic filler (e.g., amorphous silica), 0.05-10pts.wt. coupling agent selected from the group consisting of compounds of formulas I -III (wherein R<1> is H or a 1-5-valent organic group, R<2> and R<3> are each H or a monovalent organic group, A is a group of formula IV, B is a group of formula V, Z is O or a group of formula IV, R<4>, R<6>, and R<7> are each H or a monovalent organic group, R<5> is a bivalent organic group, X is an OH group or a hydrolyzable group, m and n are each 1-5, and a is 0-2), and their hydrolysates.
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