| 摘要 |
PURPOSE:To provide a curable composition containing polyamic acid, a reaction product of tetracarboxylic acid (anhydride) and diamine and a precursor for epoxy resin, having high adhesive strength and excellent heat resistance and suitable as adhesive for conductive electronic materials. CONSTITUTION:A polyamic acid is prepared by reaction of a tetracarboxylic acid (anhydride) such as pyromelletic acid or 3,3',4,4'-benzophenonetetracarboxylic acid with a diamine (e.g. p-phenylenediamine or ethylenediamine). The curable composition is obtained by mixing the polyamic acid with a precursor for epoxy resin (e.g. diglycidyl ether of bisphenol A or polypropylene diglycidyl ether) by use of a solvent. An electrically conductive adhesive is obtained when an electrically conductive filler such as copper powder or acetylene black is added to the composition.
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