发明名称 MANUFACTURE OF ELECTRONIC DEVICE AND LEAD FRAME USED THEREIN
摘要 PURPOSE:To obtain the electronic device of small mounting dimensions suitable for electronic clocks and the like by a method wherein a block member is placed on a sheet of lead frame with a number of leads provided thereon in protruding manner in one body, and a groove wherein a number of parts such as an IC element sealed resin material, a crystal vibrator, a capacitor and the like will be housed are provided. CONSTITUTION:A block member 3, wherein the external electronic parts will be housed in such a manner that the leads 4a-4d provided on a lead frame 4 are protruded to outside, is fixed on a sheet of the lead frame 4 and a package 1 is formed. On this block member 3, a through hole 18 wherein an IC element sealed resin member 2 will be housed, a hole 5 wherein a battery will be placed, a hole 6 wherein a crystal vibrator will be housed, a hole 7 wherein a temperature compensating capacitor will be placed, a hole 8 wherein a trimmer capacitor will be placed, and holes 9-17 wherein other parts will be placed are provided. The electronic device is constituted as above, and after respective parts have been interconnected, they are connected to the leads 4a-4d, and a compact electronic device is formed.
申请公布号 JPS59197157(A) 申请公布日期 1984.11.08
申请号 JP19840054215 申请日期 1984.03.23
申请人 HITACHI SEISAKUSHO KK 发明人 YAMAMOTO EIJI;SHIMIZU TAKESHI;KOSAKA HIDEKI;MIMATA TSUTOMU;SHIMA YASUFUSA
分类号 H01L23/50;H01L21/56 主分类号 H01L23/50
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