| 摘要 |
<p>A printed-wiring substrate which is employed for mounting chip elements or semiconductor elements has the following configurational features. (1) A circuit substrate (10) employed is constituted by a laminated board formed by combining a resin material which has excellent insulating properties and metal foil, and an additional reinforcing material if necessary, (2) a metal sheet (20) which has an excellent thermal conductivity is firmly bonded to the surface of the substrate (10), (3) a portion of the circuit substrate surface where a semiconductor (14) will be mounted is cut out by spot facing to form a recess (13), and (4) a portion of the metal sheet (20) is exposed at the bottom of the recess (13). This printed-wiring substrate is most suitable for the mounting of semiconductor elements for various uses as a circuit substrate used in a timepiece or camera, a chip carrier, or in hybrid and plug-in packages (also called "pin-grid arrays"). </p> |
