Resin composition for solder bump formation, solder bump formation method, and member having solder bumps

摘要

The present invention provides a solder bump formation resin composition which ensures resist (e.g., dry film) removability and which exhibits excellent solder bonding performance, even when the working substrate is placed at high temperature during reflowing, baking, or a similar process. The solder bump formation resin composition contains (A) at least one species selected from among an alkali-dissoluble thermoplastic resin having an acid value (mgKOH/g) of 110 or higher, an unsaturated fatty acid polymer having an acid value of 80 or higher, and an unsaturated fatty acid-aliphatic unsaturated compound copolymer having an acid value of 50 or higher; (B) a solvent; and (C) a solder powder, and contains no activating agent.

主权项

1. A solder bump formation method which comprises:
using a solder bump formation resin composition containing (A) an alkali-soluble thermoplastic resin which is a solid at ambient temperature, (B) a solvent, and (C) a solder powder, the solder bump formation resin composition containing no activating agent, the component (A) being at least one species selected from among the group consisting of i) an unsaturated fatty acid polymer having an acid value of 80 to 110 mgKOH/g, ii) a monobasic unsaturated fatty acid-aromatic unsaturated compound copolymer having an acid value of 110 to 220 mgKOH/g, iii) a dibasic unsaturated fatty acid-aromatic unsaturated compound copolymer having an acid value of 200 to 215 mgKOH/g, and iv) a rosin-modified resin having an acid value of 140 to 220 mgKOH/g, the rosin-modified resin being at least one species selected from the group consisting of i) a rosin-modified resin prepared through adding a dibasic unsaturated fatty acid to rosin, adding a polyhydric alcohol thereto, and carrying out esterification at high temperature, ii) a rosin-modified phenolic resin, and iii) a rosin POE ester product; placing a resist layer provided with an opening on a member having a pad such that the pad is exposed to the opening; filling the opening with the solder bump formation resin composition; removing the component (B); melting the component (C) by heating; and removing the resist layer and the component (A).