Semiconductor device and semiconductor device manufacturing method

摘要

A semiconductor device includes a semiconductor element; an insulating substrate formed from stacking a rectangular shaped circuit plate, insulating plate, and metal plate, wherein the semiconductor element is fixed to the circuit plate, and the metal plate has at least one first groove portion in four corners thereof; a radiating member made of metal and having a predetermined arrangement area to dispose the insulating substrate, the radiating member having at least one second groove portion provided in four corners of the arrangement area; four positioning members disposed between the four corners of the metal plate and the four corners of the radiating member, each of the four positioning members being fitted to each of the first groove portions and second groove portions; and a solder filling a space between the insulating substrate and the radiating member, and covering the positioning members.

主权项

1. A semiconductor device, comprising:
a semiconductor element; an insulating substrate having a rectangular shaped circuit plate, an insulating plate, and a metal plate, which are stacked together, wherein the semiconductor element is fixed to the circuit plate, and the metal plate has at least one first groove portion provided in four corners thereof; a radiating member made of metal and having a predetermined arrangement area to dispose the insulating substrate, the radiating member having at least one second groove portion provided in four corners of the arrangement area; four positioning members disposed between the four corners of the metal plate and the four corners of the radiating member, each of the four positioning members being fitted to the first groove portion and the second groove portion; and a solder filling a space between the insulating substrate and the radiating member, and covering the positioning members, wherein the metal plate has a top surface fixed directly to the insulating plate on a side opposite to the circuit plate, and a bottom surface opposite to the top surface formed with said at least one first groove portion, and a remainder of an entire bottom surface not formed with said at least one first groove portion is attached to the radiating member through the solder.