| 摘要 |
PURPOSE:To prevent a wire to be in contact with chip islands or other areas than electrode of semiconductor chip by shifting a wire to the lead frame while it is sent from a capillary and energizing the wire with an energizing means in the direction being separating from the chip islands. CONSTITUTION:A bonding wire 9 such as gold wire is sent to the electrode of semiconductor chip 7 from the capillary 10 and the one end 9a of bonding wire 9 is thermally bonded. While the bonding wire 9 is sent from the capillary 10, the capillary 10 is moved as indicated by arrow mark 11 to the connecting position of lead frame 8. At this time, when the bonding wire 9 sent from the capillary 10 droops in the direction of chip islands 6, it collides with an energizing part 8a of lead frame 8 and thereby it is energized in such a direction as being separated from the chip islands 6, namely in the upper side. Thereby, it is prevented that bonding wire 9 droops and is in contact with chip island 6 and the other areas than the electrode of semiconductor chip 7. |
