发明名称 CURABLE RESIN COMPOSITION
摘要 PURPOSE:A resin composition excellent in heat resistance and curable with light, heat or electron beams, obtained by mixing a curable resin obtained from a polycyanate ester having a plurality of cyanato groups with a photocrosslinking monomer, a photosensitizer, a heat-curing catalyst, etc. CONSTITUTION:A polycyanate ester (A) having at least two cyanato groups in the molecule (e.g., 1,4-dicyanatobenzene) or its prepolymer is reacted with a compound (B) having both a 1,2-epoxy group and a radical-polymerizable double bond in the molecule (e.g., glycidyl acrylate) in such a ratio that 0.25-2 1,2- epoxy groups of component B are present per cyanato group of component A at 90-140 deg.C in the presence of a radical polymerization initiator. The produced curable resin is mixed with a photocrosslinkable monomer (prepolymer) and a photosensitizer (photopolymerization initiator) or a heat-curing catalyst (curing agent) to obtain the titled resin composition.
申请公布号 JPS59196304(A) 申请公布日期 1984.11.07
申请号 JP19830070574 申请日期 1983.04.21
申请人 MITSUBISHI GAS KAGAKU KK 发明人 TAKE MORIO;KANEHARA HIDENORI;AYANO SATOSHI;YOSHIMURA SUSUMU
分类号 C08F20/00;C08F20/10;C08F20/34;C08F22/20;C08F22/22;C08F290/00;C08F299/00;C08F299/02;C08G73/06;C08L79/04;C09D171/00;G03F7/038 主分类号 C08F20/00
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