| 摘要 |
PURPOSE:To enhance the bonding strength in a device for laminating a plurality of semiconductor pellets by forming the shape of pellet supports to enable to secure part or all of the profiles of the pellets. CONSTITUTION:A semiconductor pellet laminating device has parts 1, 10 made of a carbon material. A recess 2 to which an electrode is inserted and threaded holes 6, 7 are formed at the part 1, and a rectangular recess 8, to which a pellet is inserted, a cylindrical recess 9 to which an electrode is inserted, and a threaded hole 5 are formed at the part 10. The electrode is inserted to the recess 2 of the part 1, screws are inserted into the holes 5, 6 to fix the part 10, and a plurality of pellets are inserted into the recess 8. Then, the part 10 is secured to the other part 1, and the electrode is inserted to the recess 9, and fusion-bonded in high temperature. |
