| 摘要 |
PURPOSE:To prevent an element from cracking by mounting the element on an island which is smaller than the mounting surface of the element and reducing the shrinkage after mounting. CONSTITUTION:A semiconductor element 10 is mounted through an adhesive layer 12 on an island 11 of substantially rod shape having an area smaller than the mounting surface of the lower surface of the element. The island 11 is formed of copper or copper alloy, and the both ends 13 are used as supporting leads. When thus constructed, the shrinkage force of the layer 12 produced in case of curing can be reduced. Accordingly it can prevent the element 10 from cracking after curing. |
