| 摘要 |
PURPOSE:The titled composition for electroconductive circuits that is composed of an electroconductive powder and a thermoplastic matrix, thus showing fluidity below a certain temperature, enabling easy and steady application to rough- surface or deformed ceramic bases, and requiring no drying process after coating. CONSTITUTION:For example, (A) an electroconductive powder, (B) a thermoplastic medium such as thermoplastic wax, thermoplastic resin or their mixture in an amount of 4-70wt% based on the resultant thermoplastic electroconductive paste are combined with (C) 1-10wt% of a (colloidal) organometallic compound to give the objective composition which is solid or semisolid at room temperature and becomes fluid at 45-110 deg.C. EFFECT:The resultant composition requires no intermediate treatments such as drying, th ereby shortening production time and lowering costs.
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