| 摘要 |
PURPOSE:To seal a semiconductor element accurately and moreover easily by a method wherein an anti-sag frame and a resin composite to be fused by heating are unified to form a semiconductor sealing pellet, recess parts are formed in a wiring substrate, the under edge protruding parts of the frame are engaged therewith, and after the resin is fused by heating, the resin is hardened. CONSTITUTION:Recess parts 6a to surround an element 2 are dug in the semiconductor element 2 fixing surface of a wiring substrate 6, and after the element 2 is fixed, electrodes provided on the element thereof and the wirings of the substrate 6 are connected using fine wires. Then when the element 2 is to be resin sealed, the under edge protruding parts of an anti-sag frame 7 consisting of polyethylene terephthalate, etc. and surrounding a resin composite 8 of epoxy, etc. to be fused by heating are engaged with the recess parts 6a. After then, the composite 8 is fused by heating, and then hardened to cover the element 2 with the composite 8. Accordingly, sealing is simplified and the interface between the resin and the substrate is elongated to reduce invasion of moisture. |
