| 摘要 |
PURPOSE:To attain the reduction of the capacitance bycontriving to miniaturize a sub mount by a method wherein the titled device is constructed in such a manner that only a light emitting semiconductor element is mounted and fixed on the sub mount. CONSTITUTION:The sub mount 1 is fixed on a stem 3 made of a metal of a high thermal conductivity. A metallic layer 5 is formed on this sub mount 1. Besides, a semiconducror laser element 2 is fixed thereon by means of low melting point solder 6. Further, wires 8 and 9 are connected to the upper surface of the layer 5 and the element 2, respectively. Since only the element 2 is mounted on the sub mount 1 and the wire 8 is just fixed in such a manner, the mount 1 can be made small. As a result, the capacitance of the sub mount 1 reduces, and accordingly the modulation of long wavelength communication is enabled at a high speed. |
