| 摘要 |
PURPOSE:To improve the curing shrinkability, adhesive strength and heat deteriorating property by adding a specified compound and a photosensitizer as essential components. CONSTITUTION:This photosensitive resin composition contains a compound represented by formula I and a photosensitizer as essential components. The compound has a group represented by formula II or III as R in the formula I . For example, the compound is prepd. by diolating an epoxy compound obtained from epichlorohydrin and bisphenol A, modifying it to acetal, and forming 2-methylene-1,3-dioxoran rings represented by the formula II at both terminals. The photosensitive resin composition obtd. by adding the photosensitizer and other additives to the prepd. addition polymerizable monomer has a low coefft. of curing shrinkage and high adhesive strength to a substrate, so it shows superior properties when used as a photosensitive adhesive or a photosensitive coating material. Since the composition has radical polymerizability, heating is not essentially required, so any ionic substance is not introduced into the material, and heat deterioration is not caused. The composition is very useful as an adhesive or to manufacture a composite material. |
