发明名称 PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE ELEMENT
摘要 PURPOSE:To improve the transparency and resolution by adding a specified amount of halogen atoms to a system consisting of Sb2O3, a photopolymerizable compound having two or more terminal ethylene groups, a thermoplastic org. polymer and a sensitizer. CONSTITUTION:This photosensitive resin composition consists of 0.1-15pts.wt. Sb2O3 (a) of <=0.1mum average particle size, 20-80pts.wt. photopolymerizable compound (b) having two or more terminal ethylene groups, 20-80pts.wt. thermoplastic org. polymer (c), 0.5-10pts.wt. photopolymerizable sensitizer (d) and halogen atoms (e) bonding to the component (b) and/or the component (c) by covalent bond. The amount of the halogen atoms is 3-30wt% of the total amount of the components (a), (b), (c), (d). The composition is formed into a layer on a support film to manufacture a photosensitive film. Since the composition contains Sb2O3 effective as a flame retardant in the form of hyperfine particles of <=0.1mum, preferably <=0.05mum average particle size together with a halogen compound, incombustibility is provided, and the transparency and resolution can be improved.
申请公布号 JPS59192244(A) 申请公布日期 1984.10.31
申请号 JP19830067514 申请日期 1983.04.15
申请人 HITACHI KASEI KOGYO KK 发明人 ISHIMARU TOSHIAKI;TSUKADA KATSUSHIGE;HAYASHI NOBUYUKI;SUGASAWA NOBORU
分类号 G03C1/00;G03F7/004;H01L21/027 主分类号 G03C1/00
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