| 摘要 |
PURPOSE:In single face wrapping method of a semiconductor wafer, to obtain a wafer having required finish thickness by sticking a detection chip to a sticking plate adhered with wafer thereby detecting the work completion time point reliably. CONSTITUTION:When wrapping, a plurality of wafers 17 are adhered to the lower face of a sticking plate 7 to rotate said plate 7 through a wrap 13 while to perform wrapping work onto the wafer 17 through a wrap 13. Here approach of a magnetic chip 11 is detected for every rotation of said plate 7 through a detector 16 and to produce a detection signal from a proximity switch 15. When the wafer 17 reaches to the predetermined finish thickness while the diamond point 8 of the sticking plate 7 contacts with the wrap 13 to reduce frictional resistance of wafer 17 against the wrap 13 thus to increase rotation of the sticking plate 7, the piston 4 is lifted to stop rotation of the wrap 13. |
