ELECTRONIC DEVICE HAVING MULTILAYER INTERCONNECTION STRUCTURE

摘要

PURPOSE:To reduce the thermal stress to generate after a resin sealing was performed by a method wherein an inorganic insulating material is used as an interlayer insulating film between wirings and organic resin material are used as a final passivation film. CONSTITUTION:A P type semiconductor region 11, an SiO2 film 12, a first layer wiring 13 and an inorganic insulating film 14 to protect the wiring 13 are formed on a substrate 10 of electronic parts. A second wiring 15 and a bonding pad 16 are arranged on the film 14. A CVD-PSG film 17a and a polyimide resin film 17b are formed on the wiring 15 as a final passivation film. Wire-bonded semiconductor parts are molded with a thermosetting resin 19.