| 摘要 |
PURPOSE:To lessen it for the titled diode to soften at the time of heating in the manufacturing process by a method wherein lead parts are formed into an alloy of copper and zirconium of 0.10-0.28wt%. CONSTITUTION:In a synthetic resin sealed-diode, heads 4 provided at the end parts of lead wires 3 constituting lead parts 2 are electrically connected to a semiconductor diode element 1, and the circumferential surface and the neighborhood of the diode element 1 are coated with a synthetic resin 5. In the lead parts 2, a coating 7 performed a nickel plating or covered with nickel is provided on strands 6 consisting of an alloy of copper and zirconium of 0.10-0.28wt% so as to wrap the strands 6 in, and, in the end parts of the lead wires 3, the heads 4 and whirl-stop parts 8, both of which have been largely spreaded in one body according to a cold forging, are formed. |
