发明名称 THERMOSETTING RESIN COMPOSITION
摘要 PURPOSE:The titled composition excellent in heat resistance, mechanical strength, moldability, and processability and useful as a material for laminates or an electrical insulating material, containing a specified maleimide compound and a soluble polyimide. CONSTITUTION:A soluble polyimide is obtained by polycondensing 1,2,3,4-butanetetracarboxylic acid (derivative) with a diamine (e.g., 4,4'-diaminodiphenylmethane) at a molar ratio of 1:1 and a temperature of 150-220 deg.C in a polar solvent (e.g., N-methylpyrrolidone). 15-85wt% di- or poly-maleimide compound of formula I or II (wherein R is a 2C or higher bivalent group and m>=0) and 85-15wt% said polyimide are dissolved in a solvent (e.g., dimethylacetamide) with stirring.
申请公布号 JPS59191726(A) 申请公布日期 1984.10.30
申请号 JP19830066351 申请日期 1983.04.15
申请人 MITSUBISHI DENKI KK 发明人 YAMAMOTO YASUSHI;SATOU SADAO
分类号 C08G73/00;C08G73/12 主分类号 C08G73/00
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