| 摘要 |
PURPOSE:To prevent contamination on the back side of a wafer even when photoresist is adhered by hanging down on a finger while a heat treatment is being performed by a method wherein the wafer is supported by a protrusion located at the tip of the finger in the vicinity of the circumference on the lower surface of the wafer. CONSTITUTION:A cut-in groove 28 facing sideway, which is a little cut into the inner part of an annular groove 24 from its side face, is provided on the front and the rear parts on both sides of the upper surface of a heat treatment pedestal 22 and a cooling processing pedestal 23. When the protrusion 41 of a pair of fingers 40, which is provided in a fixed manner on a supporting plate and which carries a wafer 21, comes to and stops at the prescribed position, the finger 40 comes down and immersed into the groove 28 on the pedestal 22, a wafer 21'' is placed on the pedestal 22, and a heat treatment is performed. When the heat treatment for the proceeding wafer 21' is finished, the finger 40 supported by the protrusion at the part located in the vicinity of the circumference on the lower surface of the wafers 21' and 21'' goes up to the upper part of the processing pedestal, said finger 40 advances as much as the space of the pedestals 22 and 23, and comes to a stop. This finger 40 can be moved in the state where it is attached to a portal frame 31 which is slidably provided on guide rails 29. |
