| 摘要 |
PURPOSE:To prevent the floating of a tab lead on the placing of a heat block, and to bond a wire with high reliability by thinning the thickness of the end section of the tab hanging lead while indenting a surface reverse to the side to which a semiconductor pellet is fixed. CONSTITUTION:Groove sections 13 are formed to surfaces, on which a pellet 1 is not fixed, in tab hanging leads 2. The groove sections 13 are formed by a press on a molding by the press of a lead frame 5, or formed through the etching of the lead frame 5. The tab hanging leads 2 can be cut easily at the groove sections 13 after a resin seal by the groove sections. Groove section 40 are shaped to the same surface as the groove sections 13 even in a plurality of leads 4 as external connecting terminals. |
