| 摘要 |
PURPOSE:To provide the titled compsn. which has excellent mold cleaning properties and gives a cured article having good markability and lead adhesion, consisting of an epoxy resin and a specified parting agent. CONSTITUTION:0.2-2.0wt% acid amide (e.g. oleamide) obtd. by condensing a 25C or lower long-chain fatty acid with ammonia or an amide is added as a parting agent to an epoxy resin. USE:Sealing of LSI, IC, semiconductors such as diode, transistor, etc.
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