| 摘要 |
PURPOSE:To make the device compact, by providing a lateral structure, wherein a pressure introducing port of a semiconductor pressure converter is in parallel with a hybrid IC, thereby decreasing a space in the direction of height when a rubber hose is provided. CONSTITUTION:A semiconductor strain gage 1 having a thin diaphragm is bonded to a die 2, and a chip holder 3 is formed. The chip holder 3 is bonded and fixed to a plastic casing 6, on which an input and output lead frame 4 and a pressure introducing part 5 are provided, by a bonding agent 7. An input and output chip 16 is connected to both ends of a hybrid IC12. Thus a semiconductor pressure converter 17 is formed. The directon of the pressure introducing port 5, which is provided on the plastic casing 6 is made parallel with the hybrid IC12. |
