| 摘要 |
PURPOSE:To provide a compact and highly integrated device, by firmly holding an outer lead pin in a lid part of a chip-carrier type outer frame body or within the extended surface of the stuck surface of a substrate, thereby reinforcing supporting power. CONSTITUTION:A die pad part 2, which is formed by a burned conductor and gold plating, is provided on the upper surface of a ceramic substrate 1. A semiconductor integrated circuit chip 3 is thermally compressed to the pad part 2. Then, each electrode pad part and a lead wire 4 on the semiconductor chip 3 are connected by using a thin gold wire 5. Thereafter, a surrounding resin body 7 is attached and formed on an upper lid part by using a resin sealing mold. At this time, the stuck surface of the surrounding resin body 7 and the ceramic substrate 1 is extended flatly along an outer lead pin 6. The outer lead pin 6 is bonded and firmly held at the extended part. |
