| 摘要 |
PURPOSE:To provide a solder alloy which is harmless, has excellent adhesive strength and operability, and reduces change in the lapse of time by mixing zinc, bismuth and tin in specific ratios. CONSTITUTION:A solder alloy of the compsn. consisting of 5-15wt% zinc, 3- 20wt% bismuth and the balance tin is prepd. The solder alloy yields substantial adhesive strength (strength to removability) even if the working temp. is low and the content of zinc is relatively low; in addition, the alloy has the characteristic that reduces change in the lapse of time. |
