| 摘要 |
PURPOSE:To provide a package itself with electrostatic protective capacity by a method wherein multiple conductors are arranged connecting with one another in a package for IC comprised of a ceramic substrate with multiple printed wirings from a terminal to a stitch for bonding on one surface of a substrate and another surface of the same while a storage battery is comprised of a substrate as a dielectric, wiring and electrode. CONSTITUTION:Multiple wirings 3 are formed on the surface of a ceramic substrate 1 as a dielectric to be connected respectively to terminals 2 provided on the periphery of the substrate 1. Next the terminals 2 are connected to multiple conductors 4 with ground terminals provided on the backside of the substrate 1 to make multiple parallel circuits with storage batteries 5 between the terminals 2 and the conductors 4. Through these procedures, IC to be loaded on the substrate 1 may be provided with electrostatic protective capacity without fail to reduce the input serial resistance improving the electric characteristics accordingly. |
