| 摘要 |
PURPOSE:To provide the titled compsn. which can form a coating film having good electrical insulating properties even at 700 deg.C and has a high bond strength at 100-300 deg.C, by blending a modified epoxy resin, a heat-resistant resin and an inorg. filler. CONSTITUTION:A modified epoxy resin (A) having an m.p. of 40 deg.C or higher and an epoxy equivalent of 400-2,000 obtd. by modifying an org. silicone intermediate (e.g. a methoxy group-contg. silicone intermediate) with 10-50wt% hydroxyl group-contg. epoxy resin (e.g. a bisphenol type epoxy resin), a heat- resistant resin (B) having a heat decomposition-initiating temp. of 200 deg.C or higher (e.g. novolak epoxy resin or phenolic resin) and an inorg. filler (C) contg. at least 10wt% low-melting glass having an m.p. of 400-500 deg.C (other components being silica, alumina, etc.) are blended together in such a proportion as to give a weight ratio of A/B of 90:10-50:50 and (A+B)/C of 20:80-60:40.
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