Liquid heat sink for cooling power semiconductor components

摘要

The invention relates to a liquid heat sink for cooling power semiconductor components, consisting of a chamber (1) through which the cooling medium flows from the input opening (7) to the output opening (8), both openings (7, 8) lying in a plane and enclosing any desired angle with respect to one another, and the heat sink chamber (1) is in contact with at least one heat-exchanging surface of the heat-generating component. The chamber (1) consists of at least two caps (2, 3) and at least one spiral separating wall (5) which, together with the caps (2, 3), forms a channel (6) for the cooling medium. Alternatively, the channel (6) can be formed by a spiral separating wall (5) which is wound in a bifilar manner, or two independent separating walls (5, 10) which are placed one inside the other. <IMAGE>