| 摘要 |
Method for facilitating the fabrication of a read-out device having large stacked printed circuit boards, each of which is provided on one of its faces with switch-selected amplifiers and to each of which a leak resistance is assigned and each of which is provided on one of its narrow sides and on a portion of the adjacent face that is equipped with the leak resistance with a thin film of electrically conductive material. According to the invention, in order to separate the thin film on the narrow sides and on the faces into individual electrodes, a laser beam is conducted over the narrow edges of the stacked printed circuit boards. This process makes it possible to divide several, preferably several hundred, narrow sides and faces simultaneously into individual electrodes in a single cutting procedure. |
