发明名称 Solderless heat exchanger.
摘要 <p>A solderless heat exchange wherein an admixture of thermally conductive fine powder and fixing agent is applied to the outer periphery (7) of each tube thereof. Ethyl Cellosolve, or a solvent, is added to the admixture to ensure that the admixture is firmly fixed to the outer periphery. Thereafter, the tubes are inserted into holes (2a) formed in fins (2) and then the tubes are expanded to join the tubes (1) to the fins. The use of the admixture accelerates the heat transfer between the tubes and the fins and improves the heat exchange efficiency.</p>
申请公布号 EP0122612(A1) 申请公布日期 1984.10.24
申请号 EP19840104163 申请日期 1984.04.12
申请人 NIPPONDENSO CO., LTD. 发明人 UEDA, AKIO;HIRAIWA, TAKASHI;ODA, SHINITI;MURAO, TOSHIAKI
分类号 F28F1/12;F28F1/32;F28F13/00;(IPC1-7):28F13/00;28F1/12 主分类号 F28F1/12
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