| 摘要 |
A heat releasing device comprises an extruded aluminum main body including a horizontal wall for attaching heat emitting elements thereto and a vertical wall formed with a large number of gouged fins on at least one of its opposite sides, and a heat pipe portion provided on or in the vertical wall. The heat released from heat emitting elements, such as semiconductor elements, mounted on the horizontal wall is absorbed by the main body, transferred to the heat pipe portion and then radiated from the fins on the vertical wall. |
