| 摘要 |
PURPOSE:To realize good direct bonding by providing a thin film consisting of fatty acid hydrogen compound having the number of carbons more than the specified one at the surface of metal member for lead frame of an integrated circuit, etc. CONSTITUTION:A metal member for lead frame having the clean surface is processed by the fatty acid hydrogen compound having the 10 or more carbons, for example, a fluid, solid or crystalline paraffin or vaseline. While a metal member is dipped into the solution having the concentration of 0.00001-1.0% obtained by dissolving these compounds into an organic solvent of low melting point, for example, into benzin, trichloroethane, tetrachloroethylene or various kinds of Freons or such solution is sprayed to said metal member surface, the solvent is dried up and thereby the thin film can be formed on the surface. |
