Sputtering system

摘要

A sputtering system including a workpiece and at least one target located in a vacuum reaction furnace, wherein a magnetic field is generated between the workpiece and the target and a electric field perpendicular to the magnetic field generated between the workpiece and the target is additionally generated. A plurality of targets may be located around the workpiece and either the workpiece or the targets may be rotated when the magnetron discharge is generated.