SEMICONDUCTOR DIAFRAME TYPE SENSOR

摘要

The pressure sensor includes a monocrystalline silicon chip defining recesses on a borosilicate glass substrate in a housing with a hollow extension for connection to a point where pressure is to be determined. Holes in the substrate provide communication between the extension and some of the recesses. Above all the recesses are provided pressure-sensitive diaphragms associated with strain gauges in electrical bridges connected by electrodes and leads to terminals. The chip and substrate are materials with similar coefficients of thermal expansion and are bonded by anoic bonding.