| 摘要 |
PURPOSE:To obtain the titled element excellent in adhesion property, hydrolytic resistance and crack resistance after resin sealing which can largely improve the reliability for moisture resistance and reduce the cost by a method wherein a semiconductor is adhered to a lead frame with a conductive adhesive containing a specific resin composition as the vehicle. CONSTITUTION:A semiconductor chip is adhered to the lead frame with the conductive adhesive whose vehicle is the resin composition made of the resin containing bismaleinimide and triazine resin monomer as the main constituent, epoxy resin, unsaturated monomer and conductive powder. It is desirable that the rate of compounding of the resin containing bismaleinimide and triazine resin monomer as the main constituent with the epoxy resin is in the range of 10:90- 90:10 (weight ratio), preferably in the range of 30:70-70:30 (weight ratio). Besides, it is desirable that the unsaturated monomer per 100pts.wt. of the total amount of said both resins is in the range of 5-150pt.wt. particularly in the range of 10-100pt.wt. It is preferable that the rate of compounding of the conductive powder with the vehicle is 60:40-90:10 (weight ratio). |
