发明名称 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND MANUFACTURE THEREOF
摘要 PURPOSE:To eliminate the lower limit of the impressed voltage onto a cell plate electrode by a method wherein the inner surface layer of a groove formed on the main surface of a semiconductor substrate is put in the conductivity type different from that of said substrate, and a capacitor wherein an insulation film and an electrode layer are formed is provided on the inner surface of the groove. CONSTITUTION:A groove is formed by etching an Si substrate 1, and an N type layer 13, the insulation film 14 for the capacitor and an electrode layer 15 are formed. Thus, the capacitor is formed by utilizing the groove, and a conductive layer of the conductivity type different from that of the Si substrate is provided on the surface of said substrate at the capacitor region, therefore the capacitor whose capacitance is large and which unnecessitates the voltage impression on the capacitor electrode can be formed.
申请公布号 JPS59184555(A) 申请公布日期 1984.10.19
申请号 JP19830056845 申请日期 1983.04.02
申请人 NIPPON DENSHIN DENWA KOSHA 发明人 MINEGISHI KAZUSHIGE;MORIE TAKASHI;NAKAJIMA BAN
分类号 H01L27/10;H01L21/822;H01L21/8242;H01L27/04;H01L27/108 主分类号 H01L27/10
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