发明名称 SOLDER DELIVERY DEVICE
摘要 A solder delivery system has a continuous element of solder material disposed between two polymeric layers, one of which is provided with window means to control the flow of solder. The layers may be separate pieces, or may be parts of a folded sheet or a tube of polymeric material. In use, the conductors to be soldered are placed on corresponding terminals of a connector body and the system placed in contact with and perpendicular to the conductors, with the side having the window means towards the conductors. On the application of heat and pressure, the solder melts and flows toward the terminals, and solder bridges are prevented by the "window frames" which lie between the terminals.
申请公布号 DE3165985(D1) 申请公布日期 1984.10.18
申请号 DE19813165985 申请日期 1981.06.08
申请人 RAYCHEM CORPORATION 发明人 GRASSAUER, WILLE K.;ROBINSON, WILLIAM M.
分类号 B23K3/06;B23K35/02;B23K35/14;H01R4/02;H01R4/72;H01R9/05;H01R43/02;H05K3/34;(IPC1-7):B23K3/06 主分类号 B23K3/06
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