发明名称 PALLADIUM BATHS FOR THE ELECTROLESS DEPOSITION
摘要 A palladium alloy plate electrolytically deposited on a catalycally active substrate contains 1-3% of amorphous boron, 1-3% of crystalline palladium or intermetallic cpds. of palladium and hydrogen with the balance amorphous palladium. The alloy plate can be strongly bonded to an electrolytic nickel plate to give a laminate. The palladium alloy deposits have high strength and hardness and are suitable for printed circuit boards, electron switch contacts, or decorative purposes.
申请公布号 KR840001725(B1) 申请公布日期 1984.10.17
申请号 KR19790004680 申请日期 1979.12.29
申请人 MINE SAFETY APPLIANCES CO. 发明人 HOUGH WILLIAM VERMON;LITTLE JOHN LEE;WARHEIT KEVIN EDWARD
分类号 C23C18/44;(IPC1-7):C23C1/14 主分类号 C23C18/44
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