发明名称 |
PALLADIUM BATHS FOR THE ELECTROLESS DEPOSITION |
摘要 |
A palladium alloy plate electrolytically deposited on a catalycally active substrate contains 1-3% of amorphous boron, 1-3% of crystalline palladium or intermetallic cpds. of palladium and hydrogen with the balance amorphous palladium. The alloy plate can be strongly bonded to an electrolytic nickel plate to give a laminate. The palladium alloy deposits have high strength and hardness and are suitable for printed circuit boards, electron switch contacts, or decorative purposes.
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申请公布号 |
KR840001725(B1) |
申请公布日期 |
1984.10.17 |
申请号 |
KR19790004680 |
申请日期 |
1979.12.29 |
申请人 |
MINE SAFETY APPLIANCES CO. |
发明人 |
HOUGH WILLIAM VERMON;LITTLE JOHN LEE;WARHEIT KEVIN EDWARD |
分类号 |
C23C18/44;(IPC1-7):C23C1/14 |
主分类号 |
C23C18/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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