A method of, and a machine for, electroplating.

摘要

There is provided, in a method of selective electroplating, the improvement comprising the utilisation of a highly conductive electrolyte, (8) compatible with the plating electrolyte (7) but containing no depositable metallic ions, to form the cathode connection to the components to be plated and, in a machine for electroplating components, the improvement comprising providing the cathode connection to the components (6) to be plated through the intermediary of a highly conductive electrolyte compatible with the plating electrolyte but containing no depositable metallic ions.