发明名称 ADHESIVE FOR ELECTROLESS PLATING
摘要 PURPOSE:To obtain an adhesive for electroless plating capable of forming a coated film free from defects by dissolving or dispersing rubber, a thermosetting resin and a filler in a selected mixed org. solvent. CONSTITUTION:Rubber such as acrylonitrile-butadiene rubber, a thermosetting resin such as phenolic resin, and a filler such as zicronium silicate are dissolved or dispersed in a mixed org. solvent such as methyl ethyl ketone contg. toluene contg. <=wt% dissolved water to obtain an adhesive for electroless plating. When the adhesive is coated on an insulating substrate or the like, the components are not coagulated, and a uniform and smooth coated film is formed after drying. A plated film wigh high adhesive strength is obtd. by carrying out electroless plating after forming the coated film.
申请公布号 JPS59182959(A) 申请公布日期 1984.10.17
申请号 JP19830056380 申请日期 1983.03.31
申请人 HITACHI KASEI KOGYO KK 发明人 TAKAHASHI HIROSHI;MOROZUMI NAOHIRO;TAKANEZAWA SHIN
分类号 C23C18/20;C09J11/06;C09J201/00;C23C18/18;H05K3/18;H05K3/38 主分类号 C23C18/20
代理机构 代理人
主权项
地址