发明名称 BALL FORMING DEVICE FOR WIRE BONDER
摘要 PURPOSE:To make electric discharge space to easily visible, and to check discrepancy of centering of a ball and mixing of an oxide when only the lower edge of the bent tip of an inactive gas introducing pipe consisting the pipe itself of an electrode material is extended, and a wire is pressed against the lower edge thereof according to a bonding tool, and a ball is to be formed at the tip of the wire by a method wherein the outer periphery and the tip of the pipe are covered with a transparent insulator, and a window is provided only at a wire inserting part. CONSTITUTION:An inactive gas introducing pipe 5 to be used both as an electrode material is bent at a right angle, only the lower edge of the tip thereof is extended, the part thereof is used as an electrode 4, and a condition opened with a window 7 is formed thereon. Then the outer face and the bent edge face of the pipe 5 are covered with a transparent silicon resin insulator 11, and a window 10 to pass a wire 2 is opened corresponding to the window 7. The device is constructed in such a way, the tip of the wire 2 is pushed in the window 10 using a bonding tool 1, and a ball 3 is provided at the tip of the wire 2 according to electric discharge between the electrode 4.
申请公布号 JPS59182534(A) 申请公布日期 1984.10.17
申请号 JP19830055234 申请日期 1983.04.01
申请人 SHINKAWA:KK 发明人 USHIKI HIROSHI;KADOSAWA MOTOAKI
分类号 H01L21/60 主分类号 H01L21/60
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