| 摘要 |
PURPOSE:To prevent a semiconductor device from invasion of moisture when the device is resin sealed by a method wherein a semiconductor element accommodating recess part is provided on the surface of an element mounting substrate, an element is fixed therein, and when the element thereof is to be connected to wiring parts adhered on the surface of the substrate using wires, the wiring parts and the wires are made of the same material, and moreover bonding parts are left without performing plating. CONSTITUTION:A recess part is provided on the surface of an element mounting substrate 3, a semiconductor element 1 is fixed therein using epoxy adhesives 11, the element 1 thereof is connected to wiring parts 14 adhered on the surface of the substrate 3 using wires 13, and the element 1 is sealed including the wires 13 using resin 12. At this construction, the ball bonding parts of the element 1 are left without performing plating, and when the wires 13 are Cu, the wiring parts 14 are also made of Cu, and moreover, when the wires 13 are Al, the wiring parts 14 are also made of Al. Accordingly, invasion of moisture from the sealing part is checked, adhesion of bonding is improved, and supersonic bonding at a low temperature is enabled. |
