Methods of manufacturing a microwave circuit

摘要

In the manufacture of a microwave circuit a semiconductor device body (1,2) is pressed into the surface of a circuit substrate (10) to deform the substrate (10) locally so as to form a recess (15) having substantially the same shape and depth as the device body (1,2). The device body (1,2) is held in the substrate (10) by the abutting walls of the recess (15), and low inductance connections are formed by conductive layer portions (23,24) extending directly across the adjacent edges of the device body (1,2) and of the recess (15). In this manner prior art problems associated with diode bodies in larger recesses are avoided. Deformation of the lower face of the substrate may be reduced, or insertion of the semiconductor body into substrates of less readily deformable material may be facilitated, by provision of an initial recess of smaller dimensions than the semiconductor body (Figure 4).