| 摘要 |
PURPOSE:To enable to securely connect a semiconductor pellet to inner leads by bonding without the generation of the edge touch failure of bonding wires by a method wherein the clearance between the upper surface a pellet bed and those of inner lead tips is fixed by connection by means of an insulation film thicker than said pellet. CONSTITUTION:The outer peripheral edge of the upper surface of the pellet bed 21 is connected and fixed to the upper surfaces of the tips of lead pins 22a, 22b,... on the side of the inner leads 24a, 24b,... by means of the ring-formed insulation film 25. In this case, the insulation film 25 is adhesion-fixed to the pellet bed 21 and the inner leads 24a, 24b,... with a resin tape of polyimide, etc., and the thickness of this film 25 is set larger than the thickness at least of said pellet 11. Then, the circuit network electrodes of said pellet 11 are connected to the inner leads 24a, 24b,... corresponding thereto by means of the bonding wires 26a, 26b,... astride over the film 25. |
