| 摘要 |
PURPOSE:To prevent the adhesion of an exfoliating piece on a wafer during treatment and the generation of temperature trouble by vertically holding the wafer and growing a film through sputtering by using a heat-resistant electrostatic chuck, which can control a temperature. CONSTITUTION:With an electrostatic chuck 10, electrodes 12a (positive) and 12b (negative) are mounted into a heat-resistant insulating film 10a, a wafer 9 is sucked by an electrostatic field formed by these electrodes 12a and 12b, and no pawl is needed. A thermocouple 14 is disposed into the insulating film 10a to detect the temperature of the wafer at all times, and the temperature of the wafer 9 can be kept at a constant one by a temperature controller 17 mounted to the electrostatic chuck 10. |
