发明名称 |
Heat-resistant synthetic resin composition |
摘要 |
A heat-resistant synthetic resin composition, which comprises (A) 15 to 60% by weight of a film-forming synthetic resin soluble in a phenolic solvent and (B) 85 to 40% by weight of a phenolic solvent, said film-forming synthetic resin containing at least 30% by weight of a polyamide imide type resin obtained by causing (a) a tricarboxylic acid and/or an anhydride thereof containing citric acid and (b) a diisocyanate and/or a derivative obtained by masking diisocyanate with a phenolic compound in amounts of substantially equal moles to react in the phenolic solvent.
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申请公布号 |
US4477624(A) |
申请公布日期 |
1984.10.16 |
申请号 |
US19820426833 |
申请日期 |
1982.09.29 |
申请人 |
SHOWA ELECTRIC WIRE & CABLE CO., LTD. |
发明人 |
WAKI, MISAO |
分类号 |
C08G73/14;C08L79/08;C09D179/08;(IPC1-7):C08G18/34;C08G18/80;C08K5/13 |
主分类号 |
C08G73/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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