| 摘要 |
PURPOSE:To enable to diagnose the failure correctly without being affected by peripheral circuits even in the state of mounting on a printed circuit board, etc. by a method wherein the first pin group for mounting and the second pin group exclusive to circuit diagnosis are provided, and the direction of each pin tip of this second pin group is made different from that of each pin tip of the first one. CONSTITUTION:The pins 16, 16... are installed to the lower layer part 12 of a ceramic package with the direction (direction at which pin tips point) downward, and while the pins 17, 17... to the upper layer part 11 thereof with the direction upward. Inner leads 18 and 19 and bonding pads 15 and 15 on an IC chip are put in bonding connection via bonding wires 20 and 20. It is not always necessary to separately provide the pads which can be used in common for the operation and diagnosis in a normal state, of the bonding pads 15, 15... on the IC chip 14. |
