发明名称 |
METHOD AND DEVICE FOR OPERATING WAFER |
摘要 |
A wafer handling method and apparatus insures proper centering of a wafer at a work station and controls the heat transferred to the wafer in a baking operation. The amount of heat transferred and the rate at which the heat is transferred to the wafer are regulated by controlling the distance between the wafer and a hot plate. The hot plate is maintained at a constant temperature higher than the bake out or equilibrium temperature to which the wafer is to be heated. |
申请公布号 |
JPS59181617(A) |
申请公布日期 |
1984.10.16 |
申请号 |
JP19830185215 |
申请日期 |
1983.10.05 |
申请人 |
SHIRIKON BAREI GURUUPU INC |
发明人 |
YOHAN TAMU;YARAARU ASHIYUJIYAII;NOBUO BII KUWAKI;TSUAN MIN NGO;SUUZAN DABURIYUU KUNGU |
分类号 |
B65G43/08;B65G49/07;B65H5/02;B65H9/14;G03F7/26;H01L21/00;H01L21/027;H01L21/677;H01L21/68 |
主分类号 |
B65G43/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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