| 摘要 |
PURPOSE:To prevent a peak current by efficiently forming an inductance element on an integrated circuit chip, serially inserting power wirings to smoothen a power current together with a capacity. CONSTITUTION:An internal circuit 2 made of a plurality of elements and wirings is formed on an integrated circuit chip, and bonding pads A1-A4, B1-B4 are arranged on the outer periphery. An inductance element 3 in which a conductor film of one layer is spirally patterned to surround the inside of the pad except the pad A2 between the pads A1 and A2 to become the power terminal on the chip. In this manner, the wirings from the pads to the internal circuit are not disturbed but the inductance element is formed, and the size can be sufficient. |
